Precision Laser Cut Thin Aluminum Nitride Plate Aln Ceramic Substrate

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors
• Material: AlN
• Model NO.: JJBP-0141-0021
• Forming Method: Tape Casting
• Feature: High Thermal Conductivity, Cte Matching Si
• Optional Color: Gray, Ivory
• Density: Over 3.33G/Cm3
• Standard Thickness: 0.38-3mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Customized Service: OEM, ODM, Prototyping, Mass Production
• Transport Package: Individual Packaging
• Trademark: JinghHui
• Origin: China
• HS Code: 6914100000
• Production Capacity: 50000 Pieces/Month
• Package Size: 27.00cm * 17.00cm * 20.00cm
• Package Gross Weight: 2.000kg

Product Description

Precision Laser Cut Thin Aluminum Nitride Plate AlN Ceramic Substrate

Product Introduction

About Laser Cutting

Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.

Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture.

With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.

As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.

Product Specifications

We can make various specifications. The table below shows our standard sizes.
 

AlN Ceramic Substrate
Thickness (mm)	Maximum Size (mm)			Shape			Forming Method
	As-fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
≥0.2		114.3	114.3		√	√	Tape Casting
0.38	140×190	140×190	120	√	√		Tape Casting
0.5	140×190	140×190	120	√	√		Tape Casting
0.635	140×190	200	200	√	√	√	Tape Casting
1	140×190	300	200	√	√	√	Tape Casting
1.5		300	200		√	√	Tape Casting
2		300	200		√	√	Tape Casting
2.5		300			√	√	Tape Casting
3		300			√	√	Tape Casting
…		450			√	√	Isostatic Pressing
10		450			√	√	Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

Manufacturing Capacity

Laser Processing

(1) Hole Size
 

AlN Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing
 

AlN Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.5<T≤1.0	50%±3%
1.0<T≤1.2	55%±3%
1.2<T≤1.5	60%±3%
2.0	45% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Why Choose Us?

We have been making ceramic substrates for more than 15 years. We can meet your various customized requirements, and our products have high dimensional accuracy and excellent performance. Please feel free to contact us.