| Application: | Laser Diode (Ld) |
|---|---|
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | Aluminum Nitride (Aln) Ceramic |
| Surface Metallization Process: | Direct Bonded Copper (Dbc / Dcb) |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Transport Package: | Vacuum Packaging |
| Customization: |
|---|
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Audited Supplier What is Direct Bonded Copper (DBC) technology?
Direct Bonded Copper (DBC) technology is a metallization method of bonding copper foil on the ceramic surface (mainly Al2O3 and AlN). The basic
principle is to introduce oxygen element between Cu and ceramic, then form Cu/O eutectic liquid phase at 1065-1083°C, and then react with ceramic
substrate and copper foil to form CuAlO2 or Cu(AlO2)2, and realize the bonding between copper foil and substrate under the action of mesophase.
Because AlN belongs to non-oxide ceramics, the key to surface copper coating is to form an Al2O3 transition layer on its surface, and realize the
effective bonding between the copper foil and the base ceramic under the action of the transition layer.
What are the Characteristics of Direct Bonded Copper (DBC) technology?
You will learn more about DBC through the following two tables.
The DBC method uses a high-temperature melting and diffusion process to bond the ceramic substrate and high-purity oxygen-free copper together.
The formed metal layer has good thermal conductivity, high adhesion strength, excellent mechanical properties, easy etching, high insulation and
high thermal cycle capacity.
DBC ceramic substrates are widely used in the packaging and heat dissipation of Insulated Gate Bipolar Transistor (IGBT), Laser Diode (LD) and
Concentrator Photovoltaics (CPV). Jinghui strictly controls the eutectic temperature and oxygen content in the process of producing DBC ceramic
substrates. The DBC technology has reached the industry-leading level and is worthy of your trust.
In order to ensure the best performance of our ceramic circuit boards, All products have to pass strict inspection before they go out.
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