Laser Cutting Processing Ceramic Substrate PCB Aln Aluminum Nitride Substrate

• Application: Blank Ceramic Circuit Board
• Standard: GB, ISO 9001
• Surface Treatment: Lapping, Polishing, Laser Scribing, Laser Cutting,
• Machining Method: CNC Machining
• Material: Aluminum Nitride Ceramic
• Forming Method: Tape Casting
• Model NO.: JJBP-0141-0021
• Features: High Thermal Conductivity, Cte Matching Si
• Optional Color: Gray, Ivory
• Density: Over 3.33G/Cm3
• Standard Thickness: 0.1-3mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Transport Package: Individual Package
• Specification: Max. up to 140mm× 190mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000
• Production Capacity: 50000PCS/Month

Product Description

Laser Cutting Processing Ceramic Substrate PCB AlN Aluminum Nitride Substrate

Jinghui Ceramic has 15 years of R&D and production experience in the field of the aluminum nitride substrate. Our products have high cost performance and will definitely satisfy you.

Product Introduction

About Laser Cutting

Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.

Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture.

With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.

As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.

Manufacturing Capacity

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

AlN Ceramic Substrate
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As-fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
≥0.2		114.3	114.3		√	√	Tape Casting
0.38	140×190	140×190	120	√	√		Tape Casting
0.5	140×190	140×190	120	√	√		Tape Casting
0.635	140×190	200	200	√	√	√	Tape Casting
1	140×190	300	200	√	√	√	Tape Casting
1.5		300	200		√	√	Tape Casting
2		300	200		√	√	Tape Casting
2.5		300			√	√	Tape Casting
3		300			√	√	Tape Casting
…		450			√	√	Isostatic Pressing
10		450			√	√	Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

Our Laser Processing Capability

(1) Hole Size
 

AlN Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing
 

AlN Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.5<T≤1.0	50%±3%
1.0<T≤1.2	55%±3%
1.2<T≤1.5	60%±3%
2.0	45% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

 

If you have specific requirements for laser cutting of the aluminum nitride substrate, please feel free to contact us.