High Quality 96% Aluminum Oxide Substrate Al2O3 Alumina Ceramic Wafer

Product Description

High Quality 96% Aluminum Oxide Substrate Al2O3 Alumina Ceramic Wafer

Product Introduction

Alumina ceramic wafers are made primarily of high-purity aluminum oxide (Al2O3) through a series of precision ceramic manufacturing processes. They typically range in thickness from a few tenths of a millimeter to several millimeters and offer excellent overall performance.

Key Features

The widespread use of alumina ceramic wafers is primarily due to their outstanding properties.

1. High Hardness and Wear Resistance: Its hardness is second only to a few materials like diamond and silicon carbide, making it extremely wear-resistant and durable.

2. Excellent Electrical Insulation: It maintains excellent electrical insulation properties even under high temperatures, high pressures, and high frequencies, a key requirement for many electronic components.

3. High Mechanical Strength: Its high flexural and compressive strengths allow it to withstand moderate mechanical stress and loads.

4. High Temperature Resistance and Thermal Stability: With a melting point of up to 2050°C and a low coefficient of thermal expansion, it maintains its shape and properties even in high-temperature environments and resists deformation.

5. Chemical Resistance: It exhibits excellent resistance to most acids, bases, and solvents, and is chemically stable.

6. Good Thermal Conductivity: While not as good as metal, it is worse than most ceramic materials, facilitating heat dissipation within components.

 

Product Parameters

Alumina Ceramic Wafer
Item	Unit		96% Al2O3
Mechanical Properties
Color	/	/	White
Density	Drainage Method	g/cm^3	≥3.70
Light Reflectivity	400nm/1mm	%	94
Flexural Strength	Three Point Bending	MPa	>350
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0
Vickers Hardness	Load 4.9N	GPa	14
Young's Modulus	Stretching Method	GPa	340
Water Absorption		%	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8
Thermal Conductivity	25ºC	W/m·K	>24
Thermal Shock Resistance	800ºC	≥10 Times	No Crack
Specific Heat	25ºC	J/kg·k	750
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3
Volume Resistivity	25ºC	Ω·cm	≥10^14
Dielectric Strength	DC	KV/mm	≥15

Applications

Due to these properties, alumina ceramic wafers play a key role in the electronics industry.

1. IC substrates/packages: Serving as a carrier for the chip, they provide mechanical support, electrical insulation, and heat dissipation.

2. Insulating heat sinks: Used between power devices (such as IGBTs) and LED wicks and heat sinks, providing both insulation and thermal conductivity.

3. Circuit boards: Used in high-temperature or high-frequency circuits (such as radio frequency microwave circuits).

 

Product Specifications

We can make various specifications. The table below shows our standard sizes.
 

Alumina Ceramic Wafer
96% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Forming Method
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

 

Product Recommendations

We have been making ceramic substrates for more than 15 years. We can meet your various customized requirements, and our products have high dimensional accuracy and excellent performance. Please feel free to contact us.