Fired 96% Alumina Aluminum Oxide Substrate for Power Electronics

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Refractory, Electronics, Structure Ceramic, Industrial Ceramic, Functional Ceramic
• Material: Alumina Ceramic
• Model NO.: JJBP-0111-0011
• Forming Method: Tape Casting
• Features: High Mechanical Strength, Small Dielectric Loss
• Usage: Blank Ceramic Circuit Board
• Optional Color: White, Ivory, Pink, Black
• Standard Thickness: 0.25-2.0mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Type: Ceramic Plates
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

Fired 96% Alumina Aluminum Oxide Substrate for Power Electronics

Product Introduction

Ceramic substrates are commonly used materials in power modules. They have special thermal, mechanical, and electrical properties that make

them ideal for demanding power electronics applications. These substrates enable the electrical function of the system and provide mechanical

stability and excellent thermal performance so as to meet the requirements of various unique designs.

Characteristics of Alumina Ceramic Substrates

1. High Wear & Chemical Resistance	2. Heat Resistant	3. High Mechanical Strength
4. Small Dielectric Loss	5. Good Thermal Conductivity	6. High Light Reflection
7. 0% Water Absorption

Product Parameters

Alumina Ceramic Substrate
Item	Unit		96% Al2O3
Mechanical Properties
Color	/	/	White
Density	Drainage Method	g/cm^3	≥3.70
Light Reflectivity	400nm/1mm	%	94
Flexural Strength	Three Point Bending	MPa	>350
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0
Vickers Hardness	Load 4.9N	GPa	14
Young's Modulus	Stretching Method	GPa	340
Water Absorption		%	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8
Thermal Conductivity	25ºC	W/m·K	>24
Thermal Shock Resistance	800ºC	≥10 Times	No Crack
Specific Heat	25ºC	J/kg·k	750
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3
Volume Resistivity	25ºC	Ω·cm	≥10^14
Dielectric Strength	DC	KV/mm	≥15

Applications

Manufacturing Capacity

1. Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

Alumina Ceramic Substrate
96% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

2. For products that require high dimensional accuracy, we can use various processing methods to process ceramic substrates, such as lapping,

polishing, laser scribing, laser cutting, etc. 

Product Recommendations

The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Contact us today with your specifications.