| Application: | Structure Ceramic, Industrial Ceramic |
|---|---|
| Type: | Ceramic Plates |
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | 96%, 99.6% Alumina |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Usage: | to Realize Electrical Connections |
| Customization: |
|---|
Suppliers with verified business licenses
Audited Supplier Ceramic substrate metallization is to firmly adhere a layer of metal film on the surface of ceramic substrate to realize the welding between ceramic
and metal. There are many ceramic substrate metallization processes such as Mo-Mn method, electroless nickel plating method, silver firing method,
and Direct Bonded Copper (DBC) method.
The Mo-Mn method is also called the high-melting-point metal method. It is based on the refractory metal powder Mo, and then mixes with a small
amount of low-melting-point Mn to the metallization formula, adds a binder to coat the ceramic surface, and then sinters to form a metallization layer.
This method is mainly used in the metallization of Al2O3.
The following is a schematic diagram of the Mo-Mn Method of the ceramic substrate surface metallization process.
Jinghui is a manufacturer of proofing and production of ceramic circuit boards. We have more than ten years of experience in circuit board
production. We can process precision circuits, especially good at DBC technology, silver firing technology, electroless nickel plating technology and
Mo-Mn technology. You can consult Jinghui for more processing methods of ceramic substrates.
Suppliers with verified business licenses
Audited Supplier 
){kind=link}
){kind=link}