• High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer
  • High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer
  • High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer
  • High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer
  • High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer
  • High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer

High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer

Application: Electronics, Medical, Refractory, Industrial Ceramic
Type: Ceramic Plate
Forming Method: Tape Casting
Samples:
US$ 5/Piece 1 Piece(Min.Order)
| Order Sample
Customization:
Shipping Cost:

Estimated freight per unit.

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Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
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High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer pictures & photos
High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer
US $5-100 / Piece
Min. Order: 10 Pieces
Diamond Member Since 2020

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Rating: 5.0/5
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  • Overview
  • Technical Datasheet
  • Why choose us?
  • We also produce
  • Our Partners
  • FAQ
Overview

Basic Info.

Model NO.
Customized
Features
High Thermal Conductivity, Cte Matching Si
Usage
Blank Ceramic Circuit Board
Optional Color
Gray, Ivory
Density
Over 3.33G/Cm3
Thickness Tolerance
±0.03 (Standard) / ±0.01 (Best)
Length and Width Tolerance
±2mm
Material
Aluminum Nitride Ceramic
Transport Package
Individual Package
Specification
Standard Size: 50.8mm x 50.8mm, Or Customized
Trademark
JingHui
Origin
China
HS Code
8547100000

Packaging & Delivery

Package Size
36.00cm * 20.00cm * 24.00cm
Package Gross Weight
8.000kg

Product Description

High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer

Technical Datasheet

Why Choose Ceramic Substrates?

High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer

Why Choose the Aluminum Nitride Ceramic Substrate?

The aluminum nitride ceramic substrate has excellent thermal conductivity, reliable electrical insulation, low dielectric constant, and dielectric loss, and is ideal for heat dissipation and packaging of LED lighting, large-scale integrated circuits, semiconductor modules circuits, and high-power devices.

Through the table below, you can see some performance comparisons between aluminum nitride (AlN) ceramic substrates and alumina (Al2O3) ceramic substrates.

Properties Unit AlN 96% Al2O3
Density g/cm³ ≥3.33 ≥3.70
Flexural Strength MPa ≥380 >350
Max. Service Temperature (Non-loading) ºC >1000 1200
CTE 20-800ºC, 10-6/ºC 4-6 7.8
Thermal Conductivity 20ºC, W/m·K 170-230 >24
Dielectric Strength KV/mm ≥17 ≥15
 

Why choose us?

Our Manufacturing Capacity


Products of various specifications can be produced. The table below shows our standard thicknesses and sizes. The ultra-thin of 0.1mm to 0.2mm AIN Ceramic Substrate will be achieved by lapping.
 
AlN Ceramic Substrate
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As-fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   Tape Casting
≥0.2   114.3 114.3   Tape Casting
0.38 140×190 140×190 120   Tape Casting
0.5 140×190 140×190 120   Tape Casting
0.635 140×190 200 200 Tape Casting
1 140×190 300 200 Tape Casting
1.5   300 200   Tape Casting
2   300 200   Tape Casting
2.5   300     Tape Casting
3   300     Tape Casting
  450     Isostatic Pressing
10   450     Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.
 

We also produce

Besides bare ceramic substrates, we also manufacture metalized ceramic PCBs. Metalized ceramics is one of our advantageous products.

 
High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer
High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer
High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer

Our Partners

High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer

 

FAQ

Q1: What is the Maximum Service Temperature of the Aluminum Nitride Ceramic Substrates?

Aluminum nitride ceramic substrates can withstand high temperatures over 1000 ºC.

Q2: Do the Bare Ceramic Substrates Meet the Requirements for Metallized Ceramic Circuit Boards?
Yes. Metalized ceramic substrates, also known as metalized ceramic circuit boards, include bare ceramic substrates and metal circuit layers. Bare ceramic substrates are widely used in integrated circuit packaging, LED lighting, heat dissipation substrates, and other fields in the electronic industry due to their advantages of thinness, high-temperature resistance, high electrical insulation performance, low dielectric loss, and good chemical stability.

Q3: Can We Get Free Samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect a sample fee for MOQ.

Q4: How Long is the Production Lead Time?
If the product is in stock, we will ship it within 1-2 days. The standard lead time for other orders is 4-6 weeks.

Q5: What is the Depth of the Laser Scribing?
The depth of the laser scribing of our ceramic substrate is about 35%-63% of the substrate thickness. The scribing spot can be in different sizes. Generally, there are small spots 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spots 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

If your question is not listed here, please contact us for more information.

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From payment to delivery, we protect your trading.
High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer pictures & photos
High Thermal Conductivity Aluminum Nitride Ceramic Aln Substrate Manufacturer
US $5-100 / Piece
Min. Order: 10 Pieces
Diamond Member Since 2020

Suppliers with verified business licenses

Secured Trading Service
Rating: 5.0/5
Manufacturer/Factory, Trading Company, Group Corporation
Registered Capital
1000000 RMB
Plant Area
20000 square meters