Thin Rectangular Al2O3 Sheet High Purity Alumina Ceramic Substrate

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors
• Material: Al2O3
• Model NO.: JJBP-0111-0017
• Forming Method: Tape Casting
• Purity of Material: 96%, 99.6% Alumina
• Features: High Mechanical Strength, Small Dielectric Loss
• Usage: Blank Ceramic Circuit Board
• Optional Color: White, Ivory, Pink, Black
• Density: Over 3.70g/cm3
• Standard Thickness: 0.1-2.0mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Customized Service: OEM, ODM, Prototyping, Mass Production
• Transport Package: Individual Packaging
• Specification: Standard or Customized
• Trademark: JingHui
• Origin: China
• HS Code: 6914100000
• Production Capacity: 50000 Pieces/Month
• Package Size: 27.00cm * 17.00cm * 20.00cm
• Package Gross Weight: 2.000kg

Product Description

Thin Rectangular Al2O3 Sheet High Purity Alumina Ceramic Substrate

Product Introduction

The alumina ceramic substrate has the following advantages:

1. Rich raw material sources.
2. Low cost.
3. High mechanical strength and hardness.
4. Good insulation and thermal shock performance.
5. Chemical corrosion resistance.
6. High dimensional accuracy.
7. Good adhesion to metals.

Alumina is a ceramic substrate material with good comprehensive performance. Alumina ceramic substrates are widely used in the electronics industry, accounting for more than 80% of the total ceramic substrates, and have become an indispensable material for the electronics industry.
 

Applications

Here is the typical application scenarios of alumina ceramic substrates.
 

Product Inspection

Packaging & Shipping

Product Parameters

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	Ivory
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

Why Choose Us?

Thank you very much for your interest in our alumina ceramic substrates. In order to meet different market requirements, we put our unceasing efforts to promote quality control. Please contact us for further information.