Diamond Member Since 2020 
Audited Supplier
| Reference FOB Price: | US $1.00-10.00 / Piece |
|---|---|
| Min. Order: | 10 Pieces |
| Application: | Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic |
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| Type: | Ceramic Plates |
| Forming Method: | Tape Casting |
| Purity of Material: | 96%, 99.6% Alumina |
| Features: | High Mechanical Strength, Small Dielectric Loss |
| Usage: | Blank Ceramic Circuit Board |
About Laser Processing
The structure of the ceramic substrate is dense, but it has a certain degree of brittleness. Although it can be processed by ordinary mechanical methods, there is stress in the processing process, especially for some thin ceramic sheets, which are easily broken. Thus the processing of ceramic substrates become a difficulty, limiting the wide application of ceramic substrates.
The laser processing technology has the advantages of non-contact, flexibility, high efficiency, easy realization of digital control, and high precision. It has become one of the most ideal methods for ceramic substrate processing today.
Our Laser Processing Capabilities
(1) Hole Size
| Alumina Ceramic Substrate | |
| Hole Diameter (mm) | Standard Tolerance (mm) |
| φ≤0.5 | 0.08 |
| φ>0.5 | 0.2 |
(2) Laser Scribing
| Alumina Ceramic Substrate | |
| Substrate Thickness (mm) | the Percentage of Laser Scribe Line Depth to Thickness (%) |
| 0.2-0.3 | 40%±5% |
| 0.3<T≤0.5 | 50%±3% |
| 0.5<T≤1.0 | 43%±3% |
| 1.2 | 55%±3% |
| 1.5 | 55%±3% |
| 2.0 | 55%+10% |
| The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. | |
Introduction of Alumina Ceramic Substrates
Alumina (Al2O3) is one of the most widely used ceramics and the most mature ceramic substrate material because of its high mechanical strength, good insulation, high temperature resistance, good stability, high cost performance and good resistance to thermal shock.
The manufacturing and processing technology of alumina ceramic substrates are very mature. Alumina ceramic is an excellent raw material for electronic ceramic substrates, and is widely used in thick film circuits, thin film circuits, hybrid circuits, multi-chip components and high-power IGBT modules and other fields.
Our Regular Sizes
| Alumina Ceramic Substrate | |||||||
| 99.6% Al2O3 | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
| As Fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
| 0.25 | 114.3 | 114.3 | √ | Tape Casting | |||
| 0.38 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.5 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.635 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. | |||||||
| 96% Al2O3 | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
| As Fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.3 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.38 | 140×190 | √ | Tape Casting | ||||
| 0.5 | 140×190 | √ | Tape Casting | ||||
| 0.635 | 140×190 | √ | Tape Casting | ||||
| 0.76 | 130×140 | √ | Tape Casting | ||||
| 0.8 | 130×140 | √ | Tape Casting | ||||
| 0.89 | 130×140 | √ | Tape Casting | ||||
| 1 | 280×240 | √ | Tape Casting | ||||
| 1.5 | 165×210 | √ | Tape Casting | ||||
| 2 | 500×500 | √ | Tape Casting | ||||
| Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. | |||||||
Product Parameters
| Alumina Ceramic Substrate | ||||
| Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
| Mechanical Properties | ||||
| Color | / | / | White | Ivory |
| Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
| Light Reflectivity | 400nm/1mm | % | 94 | 83 |
| Flexural Strength | Three Point Bending | MPa | >350 | >500 |
| Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 | 3.0 |
| Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
| Young's Modulus | Stretching Method | GPa | 340 | 300 |
| Water Absorption | % | 0 | 0 | |
| Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
| Thermal Properties | ||||
| Max. Service Temperature (Non-loading) | / | ºC | 1200 | 1400 |
| CTE (Coefficient of Thermal Expansion) | 20-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
| Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
| Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
| Specific Heat | 25ºC | J/kg·k | 750 | 780 |
| Electrical Properties | ||||
| Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
| Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 | ≤2 |
| Volume Resistivity | 25ºC | Ω·cm | ≥1014 | ≥1014 |
| Dielectric Strength | DC | KV/mm | ≥15 | ≥15 |
Why Choose Us?
2. Various processings are available (surface lapping & polishing, laser scribing & cutting, metallization, etc.).
3. Sufficient manufacturing capacity and advanced detection equipments.
4. With sufficient stock for all standard sizes, and with flexible delivery.
5. Stable quality, consistent product specifications for each batch.