| Application: | Structure Ceramic, Industrial Ceramic |
|---|---|
| Type: | Ceramic Plates |
| Finished Product: | Ceramic Circuit Board |
| Surface Metallization Process: | Electroless Nickel Plating Process |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Usage: | to Realize Electrical Connections |
| Customization: |
|---|
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Electroless nickel plating technology is a deposition process in which metals are produced through controllable redox reactions under the catalysis of
metals. Compared with electroplating nickel, electroless nickel plating has the characteristics of uniform coating, small pinholes, no need for DC
power supply equipment, deposition on non-conductors and some special properties.
In addition, due to less waste discharge, less environmental pollution and lower cost, electroless nickel plating technology has gradually replaced
electroplating nickel in many fields and has become an environmentally friendly surface treatment process.
The following is the general process of the electroless nickel plating method applied to the surface of the ceramic substrate.
Jinghui has advanced metallized ceramic substrate production equipment and technology, and can meet customers' R&D process and production
needs with fast delivery and stable quality, giving priority to quality and helping customers seize market opportunities.
In order to ensure the best performance of our ceramic circuit boards, all products have to pass strict inspection before they go out.
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