Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board

• Dielectric: Alumina Ceramic
• Finished Product: Ceramic Circuit Board
• Substrate Material: 96%, 99.6% Alumina
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: Customized
• Surface Metallization Process: Mo-Mn Metallization and Ni Plating
• Feature: Excellent Electrical and Thermal Properties
• Usage: to Realize Electrical Connections
• Transport Package: Vacuum Packaging
• Specification: According to the Drawing
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000
• Package Size: 36.00cm * 20.00cm * 24.00cm
• Package Gross Weight: 8.000kg

Product Description

Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board

Product Introduction

With the continuous development of power device technology,

especially with the rise of the third-generation semiconductor

technology, the application fields and demand of ceramic substrates

continue to expand due to their good thermal conductivity, heat

resistance, high strength and high reliability.

The metallization of the surface of the ceramic substrate is an

important prerequisite for determining its practical application, because

the metal is the component that is connected to the working circuit,

and the effective combination of the two improves the performance of

electronic products.

 

Production Process

There are many metallization methods on the surface of ceramic substrates and now we would like to introduce you to the Mo-Mn

method. In the field of ceramic substrate metallization, the most widely used method is the Mo-Mn (molybdenum-manganese) method. The main

advantages of the Mo-Mn method are:

1. The process is mature and stable;

2. High sealing strength, especially suitable for applications under harsh mechanical and climatic conditions;

3. It can be repaired many times without damaging the metallization layer;

4. The requirements for solder, metallization paste formula and sintering atmosphere are not very strict, and the process is easy to master.


The following is the general process of the Mo-Mn method applied to the surface of the ceramic substrate.

Our Advantages

Jinghui is a professional manufacturer of metallized ceramic substrates. It is our goal to provide ideal solutions for customers' different application

requirements. Whether it is cost or engineering solutions, our goal is to find the most economical and suitable solution for our customers!

Product Inspection

In order to ensure the best performance of our ceramic circuit boards, All products have to pass strict inspection before they go out.