Ultra Thin 0.1mm 0.2mm Aln Sheet Lapped Aluminium Nitride Substrate

• Application: Industrial Ceramic
• Type: Ceramic Plate
• Forming Method: Tape Casting
• Features: High Thermal Conductivity, Cte Matching Si
• Usage: Blank Ceramic Circuit Board
• Optional Color: Gray, Ivory
• Model NO.: JJBP-0141-0015
• Density: Over 3.33G/Cm3
• Thickness Tolerance: ±0.03 (Standard) / ±0.01 (Best)
• Length and Width Tolerance: ±2mm
• Material: Aluminum Nitride Ceramic
• Transport Package: Individual Package
• Specification: Standard Size: 50.8mm x 50.8mm, Or Customized
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

Ultra Thin 0.1mm 0.2mm AlN Sheet Lapped Aluminium Nitride Substrate

Technical Datasheet

Why Choose Ceramic Substrates?



Why Choose the Aluminum Nitride Ceramic Substrate?

The aluminum nitride ceramic substrate has excellent thermal conductivity, reliable electrical insulation, low dielectric constant and dielectric loss, and is ideal for heat dissipation and packaging of LED lighting, large-scale integrated circuits, semiconductor module circuits and high-power devices.

Through the table below, you can see some performance comparisons between aluminum nitride (AlN) ceramic substrates and alumina (Al2O3) ceramic substrates.

Properties	Unit	AlN	96% Al2O3
Density	g/cm³	≥3.33	≥3.70
Flexural Strength	MPa	≥380	>350
Max. Service Temperature (Non-loading)	ºC	>1000	1200
CTE	20-800ºC, 10^-6/ºC	4-6	7.8
Thermal Conductivity	20ºC, W/m·K	170-230	>24
Dielectric Strength	KV/mm	≥17	≥15

 

Why choose us?

Our Manufacturing Capacity

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes. The ultra thin of 0.1mm to 0.2mm AIN Ceramic Substrate will be achieved by lapping.
 

AlN Ceramic Substrate
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As-fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
≥0.2		114.3	114.3		√	√	Tape Casting
0.38	140×190	140×190	120	√	√		Tape Casting
0.5	140×190	140×190	120	√	√		Tape Casting
0.635	140×190	200	200	√	√	√	Tape Casting
1	140×190	300	200	√	√	√	Tape Casting
1.5		300	200		√	√	Tape Casting
2		300	200		√	√	Tape Casting
2.5		300			√	√	Tape Casting
3		300			√	√	Tape Casting
…		450			√	√	Isostatic Pressing
10		450			√	√	Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

 

We also produce

Beside bare ceramic substrates, we also manufacture metallized ceramic PCBs. Metallized ceramics is one of our advantageous products.

 

Our Partners

 

FAQ

Q1: What is the Maximum Service Temperature of the Aluminum Nitride Ceramic Substrates?

Aluminum nitride ceramic substrates can withstand high temperature over 1000 ºC.

Q2: Do the Bare Ceramic Substrates Meet the Requirements for Metallized Ceramic Circuit Boards?
Yes. Metallized ceramic substrates, also known as metallized ceramic circuit boards, include bare ceramic substrates and metal circuit layers. Bare ceramic substrates are widely used in integrated circuit packaging, LED lighting, heat dissipation substrates and other fields in the electronic industry due to their advantages of thinness, high temperature resistance, high electrical insulation performance, low dielectric loss, and good chemical stability.

Q3: Can We Get Free Samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect sample fee for MOQ.

Q4: How Long is the Production Lead Time?
If the product is in stock, we will ship it within 1-2 days. The standard lead time for other orders is 4-6 weeks.

Q5: What is the Depth of the Laser Scribing?
The depth of the laser scribing of our ceramic substrate is about 35%-63% of the substrate thickness. The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

If your question is not listed here, please contact us for more information.